Product
Advanced Low-temperature Sinter Pastes engineered for high-performance electronics
TSC develops low-temperature sinter die-attach pastes for advanced semiconductor packaging and power electronics. Our pastes are designed to form high-reliability sintered joints at low temperature for applications where thermal performance, electrical conductivity, and long-term reliability are critical.
Our materials support pressureless, and pressure-assisted sintering processes for semiconductor die attachment on qualified Au, Ag, and copper-based metallization systems.
Through close collaboration with customers and partners across global markets, TSC helps enable reliable, high-performance electronic devices from development through production.
Process-Specific Materials
Pressureless materials simplify assembly by removing external pressure. Pressure-assisted materials improve densification and real contact area for larger dies or more demanding interfaces. Material selection should consider die size, metallization, bondline thickness, allowable temperature, pressure capability, atmosphere, and reliability requirements.
Metallization Compatibility
Surface finish is central to sintered-joint performance. Au and Ag surfaces generally provide stable metallization for Ag sintering. Copper-compatible products require a controlled process for oxide condition, cleanliness, storage, printing, and sintering atmosphere. We support technical evaluation for specific Cu, Ni/Au, Ag, DBC, AMB, and ceramic-metallization stacks.
Applications
Our silver sintering materials are designed for high-power and high-reliability semiconductor packaging applications, including:
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SiC MOSFET and SiC diode power modules
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GaN power devices and RF power amplifiers
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IGBT modules and industrial power conversion
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Automotive traction inverter and onboard charger systems
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Renewable-energy power conversion
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High-power LED and laser diode packages
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RF, microwave, and optical semiconductor packages
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DBC, AMB, metal-ceramic, leadframe, and Cu-based assemblies
Two product-families
1. Pressureless Silver Sinter Paste
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Low-temperature, no-external-pressure die attach
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For process simplification and delicate/thin die handling
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Compatible with qualified Au, Ag, and Cu surfaces
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For stencil printing, screen printing, and/or dispensing
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Typical target: 200–250 °C, depending on product and stack
2. Pressure-Assisted Silver Sinter Paste
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High-density die attach for demanding power applications
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Strong mechanical performance and thermal path integrity
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Suitable for SiC, GaN, IGBT, and high-power semiconductor packages
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Optimized for pressure-temperature-time sintering profiles